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BondMaster 600
BondMaster 600
The new NORTEC 600 incorporates the latest advancements in high-performance eddy current flaw detection into a compact, durable unit. With its vibrant 5.7 inch VGA color display and true full-screen mode, the NORTEC 600 produces user-selectable, highly contrast eddy current signals.
BondMaster 600 Multimode Bond Tester
High Performance through Intuitive Operation
The BondMaster® 600 delivers a powerful combination of multiple mode bond testing software and highly advanced digital electronics, providing consistently crisp and high-quality signals. Whether you are inspecting honeycomb composite, metal-to-metal bonds, or laminate composite, the BondMaster 600 offers exceptional ease-of-use thanks to its direct-access keys and streamlined interface that features convenient presets for common applications. The enhanced user interface and simplified workflow of the BondMaster 600 offers archiving and reporting that are accessible to any level of user.
The resolution and brightness of the 5.7-inch VGA screen on the BondMaster 600 handheld bond tester becomes even more apparent when switched into full-screen mode. Activated by the simple touch of a key, the full-screen mode is always accessible regardless of the display mode or inspection method you are using. The BondMaster 600 bond tester is programmed for a range of standard inspection methods, including pitch-catch RF, pitch-catch impulse, pitch-catch swept, resonance, as well as a notably improved mechanical impedance analysis (MIA) method
Portable, Lightweight, and Ergonomic
The ergonomic design of the BondMaster 600 is convenient for difficult-to-access inspection locations. For inspection in tight spaces, the factory-installed hand strap provides maximum comfort while maintaining access to the most critical functions.
Field Proven
The BondMaster 600’s case, based on a rugged, field-proven design, is world-renowned for withstanding the harshest, most demanding inspection conditions. The BondMaster 600 with its long battery life, airtight and water-resistant enclosure, high-friction bumpers, and dual-duty support stand/hook is a valuable tool for challenging inspection jobs.
Key Features
- Designed to meet the requirements of IP66.
- Long battery life (up to 9 hours).
- Compatible with existing BondMaster probes (PowerLink) and probes from other manufacturers.
- Bright, 5.7-inch color VGA display.
- Full-screen option in any display mode.
- Intuitive interface with application-specific presets.
- Instant display mode toggle using the RUN key.
- New SCAN view (profile).
- New SPECTRUM view and Frequency Tracking feature.
- Direct-access key gain adjustment.
- All-Settings configuration page screen.
- Up to two real-time readings.
- Storage capacity of up to 500 files (program and data).
- On-board file preview.
Two Models for Flexibility and Compatibility
The BondMaster 600 is offered in two models to accommodate the varying needs of composite bond testing. The basic model includes all pitch-catch capabilities, while the B600M model features all bond testing inspection methods. The upgrade from basic to multimode can also be performed remotely.
Both BondMaster 600 models are compatible with existing Olympus BondMaster probes, including those equipped with the PowerLink technology. Optional adaptor cables are available to enable compatibility with probes from other manufacturers.
| Application | Recommended Method |
| General Honeycomb Composites Skin-to-Core Disbonds | Pitch-Catch (RF or IMPULSE) |
| Honeycomb Composites Skin-to-Core Disbonds in Tapered Structures or Non-Constant Geometries | Pitch-Catch (Swept) |
| Smaller Skin-to-Core Disbonds in Honeycomb Composite | MIA |
| Identification or Repaired Areas in Honeycomb Composite | MIA |
| General Detection of Delamination in Composite | Resonance |
| Inspection of Metal-to-Metal Bonds | Resonance |
| Feature | B600 (basic) | B600M (multimode) |
| Frozen-Signals Calibration | √ | √ |
| Real-Time Readings | √ | √ |
| Application Selection | √ | √ |
| PowerLink Probe Support | √ | √ |
| Pitch-Catch RF and Impulse Modes | √ | √ |
| Pitch-Catch Swept | √ | √ |
| Mechanical Impedance Analysis (MIA) Mode | √ | |
| Resonance Mode | √ (cable included) | |
| Calibration Menu (Resonance and MIA Modes) | √ |
| General | Overall Dimensions (W × H × D) | 236 mm × 167 mm × 70 mm (9.3 in. × 6.57 in. × 2.76 in.) |
|---|---|---|
| Weight | 1.70 kg (3.75 lb), including lithium-ion battery | |
| Standards or Directives | Mil Standard 810G, CE, WEEE, FCC (USA), IC (Canada), RoHS (China), RCM (Australia and New Zealand), KCC (South Korea) | |
| Power Requirements | AC Mains: 100 VAC to 120 VAC, 200 VAC to 240 VAC, 50 Hz to 60 Hz | |
| Inputs and Outputs | One USB 2.0 peripheral port, one standard VGA analog output port, one 15-pin I/O port (male) with analog output, 3 alarm outputs. | |
| Environmental Conditions | Operating Temperature | –10 °C to 50 °C (50 °F to 122 °F) |
| Storage Temperature | 0 °C to +50 °C (32 °F to 122 °F) [with batteries] and -20 °C to +70 °C (-4 °F to 158 °F) [without batteries] | |
| IP Rating | Designed to meet requirements of IP66 | |
| Battery | Battery Type | Single lithium-ion rechargeable battery or AA size alkaline batteries (in an 8-cell holder). |
| Battery Life | Between 8 to 9 hours | |
| Display | Size (W × H; Diagonally) | 117.4 mm × 88.7 mm; 146.3 mm (4.62 in. × 3.49 in.; 5.76 in.) |
| Type | Full VGA (640 × 480 pixels) color, transflective LCD (liquid crystal display). | |
| Modes | Normal or Full screen, 8 color schemes. RUN key to toggle between screen modes. | |
| Grids and Display Tools | Choice of 5 grids, crosshairs (X-Y views only) | |
| Connectivity and Memory | PC Software | BondMaster PC software, included in base BondMaster 600 kit. BondMaster PC allows viewing saved files and printing reports. |
| Data Storage | 500 files featuring user-selectable on-board preview. | |
| Languages | English, Spanish, French, German, Italian, Japanese, Chinese, Russian, Portuguese, Polish, Dutch, Czech, Hungarian, Swedish, and Norwegian. | |
| Applications | Application Selection menu for easy and rapid configuration in all modes. | |
| Real-Time Readings | Choice of up to 2 real-time readings measuring signal characteristics (list depends on selected mode) | |
| Probes Types Supported | Probe Types | Pitch-Catch, Mechanical Impedance Analysis (MIA-B600M only) and Resonance probes (B600M only). The instrument is fully compatible with BondMaster PowerLink and non-PowerLink probes, as well as those of other main probe and accessory suppliers. |
| Bond Testing Specifications (All BondMaster Models) | Probe Connectors | 11-pin Fischer |
| Gain* | 0 dB to 100 dB in 0.1 or 1 dB increments | |
| Rotation* | 0° to 359.9° in 0.1° or 1° increments | |
| Scan View* | Variable from 0.520 s to 40 s | |
| Low Pass Filter* | 6 Hz to 300 Hz | |
| Probe Drive | LOW, MEDIUM, and HIGH user-adjustable settings | |
| Variable Persistence* | 0.1 s to 10 s | |
| Variable Display Erase* | 0.1 s to 60 s | |
| Available Alarm Types* | 3 simultaneous alarms. Choices include BOX (rectangle), POLAR (circle), SECTOR (pie), SCAN (time-based), and SPECTRUM (frequency response). | |
| Reference Dots* | Up to 25 user-defined dot recordings | |
| Pitch-Catch Specifications (All B600 Models) | Supported pitch-catch modes | User-selectable mode. Choice of RF (toneburst), Impulse (envelope) or Swept (frequency sweep) |
| Frequency Range | 1 kHz to 50 kHz (RF, Impulse) or 1 kHz to 100 kHz (Swept) | |
| Gain | 0 dB to 70 dB in 0.1 or 1 dB increments | |
| Gate | 10 μs to 7920 μs, adjustable in 10 μs steps. New Auto Gate mode automatically detects maximum amplitude. | |
| Frequency Tracking* | Up to 2 user-adjustable markers to monitor 2 specific frequencies from the Swept figure. | |
| Mechanical Impedance Analysis (MIA) Specifications (B600M Only) | Calibration Wizard | Calibration menu to determine best frequency for application, based on simple “BAD PART” and “GOOD PART” measurements |
| Frequency Range | 2 kHz to 50 kHz | |
| Calibration Wizard | Calibration menu to determine best frequency based on the probe response | |
| Frequency Range | 1 kHz to 500 kHz |
Standard Inclusions
The BondMaster® 600 is available in any of the following configurations:
Model: Basic and Multi-mode (M) .
Power cord: Over 11 power cord models available (for the DC charger).
Keypad and instruction label: English, international (icons), Chinese, or Japanese.
“Getting Started” print manual: over 9 languages available.
Items included in all BondMaster 600 models†: BondMaster 600 instrument with factory-installed hand strap, getting started manual, calibration certificate, rigid transport case, DC charger with power cord, Li-ion battery, AA battery tray, USB communication cable, MicroSD memory card and adaptor, Pitch-catch and MIA probe cable, and BondMaster PC software and product manuals disc.
BondMaster Probe and Standard Kits
| Part Number | U8 Number | Description |
| 9323977 | Q6700011 | BondMaster Starter Probe and Reference Sample Kit. Contains: External Alarm Booster, VGA Cable, Screen Protectors (10 Pack), 600 Series Soft Instrument & Accesory Case, Couplant, Backing Foam, Probe, Pitch/Catch: S-PC-P14, Probe, MIA: S-MP-3, Probe, Resonance: S-PR-5, Reference Standard: NEC-6433, Reference Standard: NEC-6407, Reference Standard: NEC-6382, Reference Standard: NEC-6384, Teflon Tape (1 inch wide), Cable, Model SBM-CR-P6, Cable, Model SBM-CPM-P11, B600 Kit Case, capable of storing instrument with protective soft cover installed. |
| BM-KIT-PC1 | U8010069 | BondMaster probe and Standard Kit for Pitch-Catch Inspections, Contains: NEC-6407 Reference Standard with S-PC-P14 Ptich Catch probe and cable. |
| BM-KIT-PC2 | U8010070 | BondMaster probe and Standard Kit for Pitch-Catch Inspections, Contains: NEC-6407 Reference Standard with S-PC-P14 and SPO-5629PHV Pitch Catch probes and cable. |
| BM-KIT-MIA | U8010071 | BondMaster Probe and Standard Kit for MIA Inspections, Contains: Contains: NEC-6407 Reference Standard with S-MP-3 MIA Probe and BMM-H Spring Holder and cable. |
| BM-KIT-RES-C | U8010072 | BondMaster Probe and Standard Kit for Resonance Inspections, Contains: NEC-6382 Compositive Reference Standard with S-PR-4 Resonance probe, couplant and cable. |
| BM-KIT-RES-A | U8010073 | BondMaster Probe and Standard Kit for Resonance Inspections, Contains: NEC-6384 Aluminum Reference Standard with S-PR-4, couplant and cable. |
| BM-KIT-PMR | U8010074 | BondMaster Probe and Standard Kit for Pitch-Catch, MIA and Resonance Inspections, Contains: NEC-6407 Reference Standard, S-PC-P14 and SPO-5629PHV Pitch-Catch Probes, S-MP-3 MIA Probe with BMM-H Spring Holder, NEC-6382 Composite Reference Standard, NEC-6384 Aluminum Reference Standard S-PR-4 REsonance probe, couplant and cables. |
| Basic Probe Kit | 9317813 | Contains: S-MP-3 Standard size tip; BMM-H Probe housing; S-PC-P11 Pitch-catch probe; S-PR-4 165 kHz resonance probe; SBM-CPM-P11 Cable (P-C and MIA); SBM-CR-P6 Cable (resonance); Couplant (4 oz) for use with resonance probes; Probe case |
| Probe Kit | 9317814 | Contains: S-MP-3 Standard size MIA probe; S-MP-4 Small MIA probe; BMM-H probe housing; S-PC-P11 Pitch-catch probe; S-PR-3 110 kHz resonance probe; S-PR-5 250 kHz resonance probe; SBM-CR-P6 Cable (resonance); Couplant (4 ox) For use with resonance probes; Probe case |
| Deluxe Probe Kit | 9322158 | Contains: S-MP-3 Standard size MIA probe; S-MP-4 Small MIA probe; BMM-H Probe housing; S-PC-P11 Pitch-catch probe; S-PC-P12 Pitch-catch probe; S-PR-3 110 kHz resonance probe; S-PR-5 250 kHz resonance probe; SBM-CPM-P11 Cable (P-C and MIA); SBM-CR-P6 Cable (resonance); Probe case |
| Air Force Probe Kit | 9322078 | Contains: S-PR-1 35 kHz Resonance probe, S-PR-2 65 kHz Resonance probe, S-PR-3 110 kHz Resonance probe, S-PR-4 165 Resonance probe, S-PR-5 250 kHz Resonance probe, S-PR-6 330 kHz Resonance probe, S-PC-P1 Pitch-catch probe, low voltage; S-PC-P12 Pitch-catch probe, high voltage; S-MP-5 Internal spring MIA probe; SBM-CPM-P11 Cable (P-C and MIA), SBM-CR-P6 Cable (Resonance); Teflon Tape 1/4 in. wide roll; Couplant 4 oz. (For use with Resonance probes) |
| BondMaster 600 | English - 2.0 MB |
Ελ. Βενιζέλου 7 & Δελφών, 14452 Μεταμόρφωση, Αθήνα, Ελλάδα |
